Light emitting device package

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United States of America Patent

PATENT NO 8124998
SERIAL NO

11225090

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Abstract

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A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be electrically connected to the light emitting device, the first and second electrodes applying a current or voltage to the light emitting device and emitting heat generated by the light emitting device.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDREPUBLIC OF KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hyung-kun Suwon-si, KR 29 293

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