Increased I/O semiconductor package and method of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 28, 2012
Grant Date -
N/A
app pub date -
Jul 28, 2008
filing date -
Jul 28, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In accordance with the present invention, there is provided a semiconductor package and a fabrication method thereof. The semiconductor package is provided with a substrate made of metal, thereby improving efficiency of thermal emission from a semiconductor die mounted to the substrate, and simplifying the fabrication process for the substrate which reduces fabricating costs. Further, unlike a conventional land, a rivet electrically insulated with the substrate is inserted into a corresponding hole of the substrate, the upper and lower surfaces of the rivet being removed to form land, thereby simplifying the fabrication process for the substrate which further reduces fabricating costs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully