Alignment of semiconductor wafer patterns by corresponding edge groups
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United States of America Patent
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Feb 28, 2012
Grant Date -
Dec 6, 2007
app pub date -
Apr 11, 2007
filing date -
Apr 12, 2006
priority date (Note) -
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Abstract
A pattern shape evaluation method includes acquiring an image of an evaluation target pattern including a plurality of element patterns; detecting edge of the evaluation target pattern from the image; classifying the detected edge of the evaluation target pattern into a plurality of evaluation target pattern edge groups; acquiring edge of a reference pattern serving as an evaluation standard for the element patterns; classifying the edge of the reference pattern into a plurality of reference pattern edge groups; selecting a reference pattern edge group to be aligned with the edge of the evaluation target pattern from the classified reference pattern edge groups; aligning the edge of the selected reference pattern edge group with the edge of the evaluation target pattern; and evaluating the shape of the evaluation target pattern by use of the result of the alignment.
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