Thermally expanded microspheres and a process for producing the same
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United States of America Patent
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Mar 6, 2012
Grant Date -
Nov 12, 2009
app pub date -
Sep 14, 2006
filing date -
Sep 16, 2005
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Abstract
Heat-expanded microspheres having high packing efficiency are produced by expanding heat-expandable microspheres, which include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
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