Nanotube modified solder thermal intermediate structure, systems, and methods

United States of America Patent

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Mar 6, 2012
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Jul 14, 2011
app pub date
Feb 19, 2007
filing date
Dec 30, 2003

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Abstract

An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.

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Patent Owner	Address
INTEL CORPORATION	SANTA CLARA CA

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Koning, Paul A	Chandler, US	55	808
White, Bryan M	Smyrna, US	6	126

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Nanotube modified solder thermal intermediate structure, systems, and methods

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11676448

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PATENT NO	8129223
APP PUB NO	20110168763A1
SERIAL NO	11676448
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 06, 2012	US,8129223,B2 US8129223B2	GRANTED PATENT AS SECOND PUBLICATION
July 14, 2011	US,20110168763,A1 US20110168763A1	FIRST PUBLISHED PATENT APPLICATION

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11676448

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