Method of manufacturing an integrated circuit module

United States of America Patent

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Mar 6, 2012
Grant Date
Feb 12, 2009
app pub date
Aug 10, 2007
filing date
Aug 10, 2007

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Abstract

A method includes providing an integral array of first carriers, arranging first semiconductor chips on the first carriers, and arranging an integral array of second carriers over the semiconductor chips.

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Patent Owner	Address
INFINEON TECHNOLOGIES AG	GERMAN NOE BE BERG NEUBIBERG BAVARIA

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Koenigsberger, Alexander	Regensburg, DE	6	69
Landau, Stefan	Wehrheim, DE	28	241
Mahler, Joachim	Regensburg, DE	224	2135
Schiess, Klaus	Allensbach, DE	85	939

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Method of manufacturing an integrated circuit module

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United States of America Patent

11837087

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PATENT NO	8129225
APP PUB NO	20090042337A1
SERIAL NO	11837087
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 06, 2012	US,8129225,B2 US8129225B2	GRANTED PATENT AS SECOND PUBLICATION
February 12, 2009	US,20090042337,A1 US20090042337A1	FIRST PUBLISHED PATENT APPLICATION

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11837087

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