Wire bond interconnection and method of manufacture thereof
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United States of America Patent
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Mar 6, 2012
Grant Date -
Nov 3, 2011
app pub date -
Jul 7, 2011
filing date -
Nov 12, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.
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