plane to accommodate high speed circuitry ground isolation
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United States of America Patent
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Mar 6, 2012
Grant Date -
Mar 18, 2010
app pub date -
Nov 24, 2009
filing date -
Apr 6, 2006
priority date (Note) -
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Abstract
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.
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