Shielding for a semiconductor package
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United States of America Patent
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Mar 6, 2012
Grant Date -
N/A
app pub date -
Dec 3, 2008
filing date -
Dec 3, 2008
priority date (Note) -
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Abstract
A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.
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