Sensor module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8130506
APP PUB NO 20090313817A1
SERIAL NO

12142380

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGGERMAN NOE BE BERG NEUBIBERG BAVARIA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Stadler, Bernd Donaustauf, DE 23 328
Theuss, Horst Wenzenbach, DE 233 3067

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