Equipment and method for cutting package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8132305
APP PUB NO 20080056832A1
SERIAL NO

11848152

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Tai-Kew Chungcheongnam-do, KR 2 8
Eum, Yo-Se Chungcheongnam-do, KR 5 6
Jang, Ho-Soo Busan, KR 4 5
Sun, Yong-Kyun Chungcheongnam-do, KR 7 40
Yang, Hee-Sang Chungcheongnam-do, KR 7 22

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