Sensor element placement for package stress compensation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 13, 2012
Grant Date -
N/A
app pub date -
Jul 31, 2008
filing date -
Aug 1, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully