Micro-fluidic injection molded solder (IMS)

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8136714
SERIAL NO

13088727

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES INCPO BOX 309 UGLAND HOUSE GRAND CAYMAN KY1-1104

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Buchwalter, Stephen L Anthem, US 58 814
Gruber, Peter A Mohegan Lake, US 123 1888
Lauro, Paul A Brewster, US 85 1976
Nah, Jae-Woong Closter, US 159 1238

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