Microfluidic module including an adhesiveless self-bonding rebondable polyimide

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United States of America Patent

PATENT NO 8137641
APP PUB NO 20110132870A1
SERIAL NO

13028550

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removing the first mask layer from the channel sheet after forming the fluid flow channel; and self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.

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Patent Owner(s)

Patent OwnerAddress
YSI INCORPORATED1700/1725 BRANNUM LANE YELLOW SPRINGS OH 95387

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moles, Donald R Cedarville, US 14 1428

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