Polyamide molding materials with an improved flowability, the production thereof and its use
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United States of America Patent
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Mar 20, 2012
Grant Date -
Feb 4, 2010
app pub date -
Aug 28, 2009
filing date -
May 20, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a housing from a polyamide molding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C07D:HETEROCYCLIC COMPOUNDS
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- B60C:VEHICLE TYRES
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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