Conductive seal ring electrostatic chuck
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United States of America Patent
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Mar 20, 2012
Grant Date -
Feb 3, 2011
app pub date -
Jan 19, 2010
filing date -
Jan 20, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealing ring disposed between the main body and the substrate wherein the sealing ring has a conductive layer.
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