US Patent No: 8,139,843

Number of patents in Portfolio can not be more than 2000

Methods and systems for utilizing design data in combination with inspection data

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ALSO PUBLISHED AS: 20110286656
ATTORNEY / AGENT: (SPONSORED)
 

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Abstract

Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KLA-TENCOR TECHNOLOGIES CORPORATIONMILPITAS, CA719

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Duffy, Brian Taunton, MA 24 175
Kulkarni, Ashok San Jose, CA 24 329
Maayah, Kais Cupertino, CA 10 126
Rouse, Gordon Dublin, CA 7 116

Cited Art

Patent Info (Count) # Cites Year
 
KLA-TENCOR TECHNOLOGIES CORPORATION (36)
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6,751,519 Methods and systems for predicting IC chip yield 49 2002
6,813,572 Apparatus and methods for managing reliability of semiconductor devices 33 2002
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6,948,141 Apparatus and methods for determining critical area of semiconductor design data 39 2002
6,734,696 Non-contact hysteresis measurements of insulating films 28 2002
6,777,676 Non-destructive root cause analysis on blocked contact or via 23 2002
7,236,847 Systems and methods for closed loop defect reduction 27 2003
7,739,064 Inline clustered defect reduction 8 2003
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7,418,124 Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns 20 2003
7,061,625 Method and apparatus using interferometric metrology for high aspect ratio inspection 25 2003
7,027,143 Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths 33 2003
7,123,356 Methods and systems for inspecting reticles using aerial imaging and die-to-database detection 45 2003
7,379,175 Methods and systems for reticle inspection and defect review using aerial imaging 29 2003
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2005/0004,774 Methods and systems for inspection of wafers and reticles using designer intent data 33 2004
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2006/0291,714 Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle 25 2004
2006/0236,294 Computer-implemented methods for detecting defects in reticle design data 44 2005
2006/0036,979 Computer-implemented methods for generating input for a simulation program or generating a simulated image of a reticle 9 2005
2006/0062,445 Methods, systems, and carrier media for evaluating reticle layout data 52 2005
2006/0082,763 Computer-implemented methods and systems for classifying defects on a specimen 27 2005
2007/0133,860 Methods and systems for binning defects detected on a specimen 13 2005
2006/0161,452 Computer-implemented methods, processors, and systems for creating a wafer fabrication process 29 2006
7,676,077 Methods and systems for utilizing design data in combination with inspection data 23 2006
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2007/0288,219 METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA 62 2006
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2009/0043,527 COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR GENERATING A METROLOGY SAMPLING PLAN 5 2007
2008/0081,385 METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA 13 2007
 
KLA-TENCOR CORPORATION (30)
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2008/0167,829 METHODS AND SYSTEMS FOR USING ELECTRICAL INFORMATION FOR A DEVICE BEING FABRICATED ON A WAFER TO PERFORM ONE OR MORE DEFECT-RELATED FUNCTIONS 9 2008
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2007/0032,896 METHOD FOR LITHOGRAPHY MODEL CALIBRATION 38 2006
2007/0035,712 SYSTEM AND METHOD FOR MEASURING AND ANALYZING LITHOGRAPHIC PARAMETERS AND DETERMINING OPTIMAL PROCESS CORRECTIONS 21 2006
 
KLA INSTRUMENTS CORPORATION (19)
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5,544,256 Automated defect classification system 220 1993
5,608,538 Scan line queuing for high performance image correction 35 1994
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APPLIED MATERIALS, INC. (14)
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UNIVERSITY OF ROCHESTER (1)
5,453,844 Image data coding and compression system utilizing controlled blurring 49 1993
 
UNIVERSITY OF SOUTH FLORIDA (1)
5,773,989 Measurement of the mobile ion concentration in the oxide layer of a semiconductor wafer 74 1995
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (7)
6,344,640 Method for wide field distortion-compensated imaging 44 2000
6,202,029 Non-contact electrical conduction measurement for insulating films 48 2000
2002/0035,717 Navigation method and device for pattern observation of semiconductor device 8 2001
2004/0030,430 Waferless metrology recipe generator and generating method 23 2003
7,136,143 Method for aberration detection and measurement 21 2003
2005/0008,218 Automated wafer defect inspection system and a process of performing such inspection 24 2004
2006/0239,536 Method for analyzing defect data and inspection apparatus and review system 16 2006

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
CADENCE DESIGN SYSTEMS, INC. (1)
8,423,924 System and method for compressed post-OPC data 0 2011
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
8,372,742 Method, system, and apparatus for adjusting local and global pattern density of an integrated circuit design 0 2010

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