Method of transferring a thin film onto a support

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United States of America Patent

PATENT NO 8142593
APP PUB NO 20090120568A1
SERIAL NO

12063808

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of transferring a thin film onto a first support, includes supplying a structure comprising a film of which at least one part originates from a solid substrate of a first material and which is solidly connected to a second support having a thermal expansion coefficient that is different from that of the first material and close to that of the first support, forming an embrittled area inside the film that defines the thin film to be transferred, affixing the film that is solidly connected to the second support to the first support, and breaking the film at the embrittled area.

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Patent Owner(s)

Patent OwnerAddress
COMMISSARIAT A L'ENERGIE ATOMIQUE31/33 RUE DE LA FEDERATION 75015 PARIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clavelier, Laurent Grenoble, FR 32 1263
Dechamp, Jerome Beaucroissant, FR 2 41
Deguet, Chrystel Saint Ismier, FR 25 190

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