Methods and apparatuses to stiffen integrated circuit package
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United States of America Patent
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Mar 27, 2012
Grant Date -
Jun 23, 2011
app pub date -
Dec 23, 2009
filing date -
Dec 23, 2009
priority date (Note) -
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Abstract
A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
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