Adhesive on wire stacked semiconductor package
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United States of America Patent
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Mar 27, 2012
Grant Date -
Apr 21, 2011
app pub date -
Nov 16, 2010
filing date -
Mar 9, 2001
priority date (Note) -
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Abstract
A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.
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