Circuit module and method
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United States of America Patent
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Mar 27, 2012
Grant Date -
N/A
app pub date -
Jul 1, 2005
filing date -
Jul 1, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit module having a distance compensation element and a method for manufacturing the circuit module. A thinned semiconductor chip is mounted to a top surface of a support substrate. The thinned semiconductor chip has an upper surface that is spaced apart from the top surface of the support substrate by a first distance. A circuit element having an upper surface is mounted to the support substrate, wherein the upper surface of the circuit element is spaced apart from top surface of the support substrate by a second distance. A height compensation element is mounted over the thinned semiconductor chip and attached to the top surface of the support substrate. The height compensation element has a surface spaced apart from the top surface of the support substrate by a distance greater than or equal to the second distance.
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