Methods of making multilayered structures

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United States of America Patent

PATENT NO 8147927
APP PUB NO 20110223321A1
SERIAL NO

13068616

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

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Patent Owner(s)

  • SP3, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chandler, Gerard James Fremont, US 3 4
Zimmer, Jerry Wayne Saratoga, US 3 4

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