Method of electrically connecting a microelectronic component
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United States of America Patent
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Apr 3, 2012
Grant Date -
Aug 13, 2009
app pub date -
Apr 9, 2009
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microelectronic assembly is provided which can include an element including a first dielectric layer and a second dielectric layer overlying the first dielectric layer, the second dielectric layer having an exposed surface defining an exposed major surface of the element. A plurality of substantially rigid metal posts can project beyond the exposed surface, the metal posts having ends remote from the exposed surface. The microelectronic assembly can include a microelectronic device which has bond pads and overlies the element. The microelectronic device can have a major surface which confronts the posts. Connections electrically connect the ends of the metal posts with the bond pads of the microelectronic device.
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