Method of electrically connecting a microelectronic component
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United States of America Patent
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Apr 3, 2012
Grant Date -
Jan 27, 2011
app pub date -
Sep 30, 2010
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a microelectronic connection component is disclosed. A plurality of portions of a conductive, etch-resistant material is provided on a surface of a metallic sheet. The sheet is etched from the surface to form posts extending generally parallel to one another aligned with the portions of the etch-resistant material. A microelectronic device is provided having one of a front face or a rear face overlying first ends of the posts. Second ends of the posts remote from the first ends face away from the microelectronic device as interconnection terminals for the connection component. At least some of the posts are electrically connected to the microelectronic device.
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