US Patent No: 8,150,243
Number of patents in Portfolio can not be more than 2000
Heating process apparatus
Stats
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Apr 3, 2012
Issued date -
Nov 5, 2009
filing date -
12/613,288
serial no -
In Force
status
Importance
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Abstract
A heating process apparatus includes a process chamber, a heat-processed object support member provided in the process chamber for heating a substrate disposed thereon, a cap for covering the substrate disposed on the heat-processed object support member, a heater for heating the heat-processed object support member, a temperature measuring unit for measuring the temperature of the heat-processed object support member, and a controller for controlling the heater. A first measuring unit measures a temperature of the cap, and the controller controls the heater so as to set the cap temperature to a predetermined temperature. A second measuring unit measures a temperature of the heat-processed object support member, and the controller turns off the heater when the temperature of the heat-processed object support member exceeds an over-heat critical temperature.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,444,217 Rapid thermal processing apparatus for processing semiconductor wafers | 110 | 1993 | |
| 5,683,518 Rapid thermal processing apparatus for processing semiconductor wafers | 69 | 1994 | |
| 5,580,388 Multi-layer susceptor for rapid thermal process reactors | 34 | 1995 | |
| 5,710,407 Rapid thermal processing apparatus for processing semiconductor wafers | 56 | 1995 | |
| 5,820,686 Multi-layer susceptor for rapid thermal process reactors | 43 | 1996 | |
| 6,310,327 Rapid thermal processing apparatus for processing semiconductor wafers | 25 | 2000 | |
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| 2008/0213,988 SUBSTRATE HEATING APPARATUS AND SEMICONDUCTOR FABRICATION METHOD | 3 | 2007 | |
| 2009/0190,908 APPARATUS FOR HEAT-TREATING SUBSTRATE AND METHOD FOR HEAT-TREATING SUBSTRATE | 6 | 2009 | |
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| 6,190,037 Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system | 16 | 1999 | |
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| 6,151,447 Rapid thermal processing apparatus for processing semiconductor wafers | 18 | 1997 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Oct 3, 2015 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 3, 2019 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 3, 2023 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |