Wafer grinding method and wafer grinding machine
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United States of America Patent
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Apr 10, 2012
Grant Date -
Oct 1, 2009
app pub date -
Mar 4, 2009
filing date -
Mar 27, 2008
priority date (Note) -
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Abstract
A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding process before the finish grinding process, the wafer thickness is measured with a noncontact-type thickness gauge, and during the finish grinding process, the finish thickness is finely adjusted by use of a contact-type thickness gauge and referring to the measurement data of the noncontact-type thickness gauge.
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