AG-based alloy sputtering target

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United States of America Patent

PATENT NO 8152976
APP PUB NO 20090057141A1
SERIAL NO

12198520

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to an Ag-based alloy sputtering target including at least one element selected from the group consisting of Ti, V, W, Nb, Zr, Ta, Cr, Mo, Mn, Fe, Co, Ni, Cu, Al, and Si in a total amount of 1 to 15% by weight, in which the Ag-based alloy sputtering target has an arithmetic mean roughness (Ra) of 2 μm or more and a maximum height (Rz) of 20 μm or more at a sputtering surface thereof.

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Patent Owner(s)

Patent OwnerAddress
SONY DADC CORPORATION1-12 KITASHINAGAWA 5-CHOME SHINAGAWA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuzaki, Hitoshi Hyogo, JP 17 178
Okawa, Naoki Tokyo, JP 11 31
Tauchi, Yuki Hyogo, JP 31 190

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