Solid element device and method for manufacturing the same

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United States of America Patent

PATENT NO 8154047
APP PUB NO 20110101399A1
SERIAL NO

12923788

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Abstract

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A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

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Patent Owner(s)

Patent OwnerAddress
TOYODA GOSEI CO LTDAICHI PREFECTURE JAPAN AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aida, Kazuya Saitama-ken, JP 14 630
Hadame, Kunihiro Aichi-ken, JP 8 609
Inoue, Mitsuhiro Aichi-ken, JP 65 2617
Kato, Hideaki Aichi-ken, JP 106 2477
Ohtsuka, Masaaki Saitama-ken, JP 18 481
Ota, Koichi Aichi-ken, JP 28 1625
Sawanobori, Naruhito Saitama-ken, JP 25 709
Suehiro, Yoshinobu Aichi-ken, JP 75 3839
Tohmon, Ryoichi Aichi-ken, JP 9 661
Wada, Satoshi Aichi-ken, JP 296 3471
Watanabe, Hiroki Saitama-ken, JP 148 1036
Yamamoto, Yoshinori Saitama-ken, JP 169 1569

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