US Patent No: 8,156,804

Number of patents in Portfolio can not be more than 2000

Capacitive semiconductor sensor

ALSO PUBLISHED AS: 20080093740
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Importance

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Abstract

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A capacitive semiconductor sensor includes a sensor chip, a circuit chip, a plurality of bumps, and a plurality of dummy bumps. The sensor chip includes a dynamic quantity detector, which has a detection axis in one direction. The circuit chip includes a signal processing circuit. The sensor chip and the circuit chip are coupled by flip-chip bonding through the plurality of bumps. Furthermore, the sensor chip and the circuit chip are mechanically coupled through the plurality of dummy bumps.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DENSO CORPORATIONKARIYA-CITY AICHI-PREF10478

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kayukawa, Kimiharu Nisshin, JP 18 12
Masuda, Michihiro Anjo, JP 6 14
Sakai, Minekazu Kariya, JP 102 841

Cited Art Landscape

Patent Info (Count) # Cites Year
 
DENSO CORPORATION (11)
6,313,529 Bump bonding and sealing a semiconductor device with solder 26 1998
6,430,999 Semiconductor physical quantity sensor including frame-shaped beam surrounded by groove 3 2001
6,502,462 Capacitance type dynamic quantity sensor having displacement portion and formed by wire bonding 5 2001
6,973,829 Semiconductor dynamic quantity sensor with movable electrode and fixed electrode supported by support substrate 7 2001
2004/0238,943 Dynamic quantity sensor 8 2003
7,268,435 Capacitive semiconductor sensor 3 2004
7,385,296 Sensor device having stopper for limitting displacement 3 2005
7,327,004 Sensor device 8 2005
2007/0090,536 Sensor having semiconductor chip and circuit chip 2 2006
7,678,589 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor 1 2007
7,762,134 Dynamic quantity sensor 5 2007
 
FUJITSU MEDIA DEVICES LIMITED (1)
7,069,789 Inertial sensor 3 2005
 
INTEGRATED SENSING SYSTEMS, INC. (1)
6,140,144 Method for packaging microsensors 128 1997
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
7,205,095 Apparatus and method for packaging image sensing semiconductor chips 4 2003
 
PANASONIC ELECTRIC WORKS CO., LTD. (1)
2008/0156,095 Sensor Device, Sensor System and Methods for Manufacturing Them 6 2005
 
TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY CO., LTD. (1)
2005/0275,099 Semiconductor apparatus and method of manufacturing semiconductor apparatus 1 2005

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ALPS ELECTRIC CO., LTD. (1)
8,459,116 Physical quantity sensor 0 2011
 
PANASONIC CORPORATION (1)
8,826,734 Inertial force sensor 0 2013

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