Integrated liquid to air conduction module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8157001
APP PUB NO 20070227708A1
SERIAL NO

11731484

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

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Patent Owner(s)

Patent OwnerAddress
VERTIV CORPORATION505 N CLEVELAND AVE WESTERVILLE OH 43082

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brewer, Richard Foster City, US 8 209
Conway, Bruce La Honda, US 39 574
Hom, James Redwood City, US 19 536
Munch, Mark Los Altos Hills, US 35 1563
Tsao, Paul Los Altos, US 20 539
Upadhya, Girish Austin, US 32 1526
Werner, Douglas E Santa Clara, US 16 584
Zhou, Peng Albany, US 284 6195

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