Integrated circuit system employing backside energy source for electrical contact formation
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United States of America Patent
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Apr 17, 2012
Grant Date -
Apr 8, 2010
app pub date -
Oct 8, 2008
filing date -
Oct 8, 2008
priority date (Note) -
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Abstract
A method for manufacturing an integrated circuit system includes: providing a first material; forming a second material over a first side of the first material; and exposing a second side of the first material to an energy source to form an electrical contact at an interface of the first material and the second material.
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