Interconnect structures for metal configurable integrated circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8159268
SERIAL NO

12947606

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Interconnect structure comprising buffers for a semiconductor device is disclosed. The buffer comprises: an input and an output; and a programmable interconnect structure comprising: a plurality of fixed interconnects including metal and via geometries; and a plurality of selectable interconnect geometries, wherein selecting a selectable geometry connects a first of said fixed interconnects to a second of said fixed interconnects; wherein said input and said output can electrically connect to a subset of said fixed interconnects by the selectable geometries; and a programmable signal restoring unit comprising a plurality of transistors, at least one said transistor having: a common gate region and a common source region; and a first drain region coupled to the buffer output comprising a said fixed interconnect; and a second drain region comprising a said fixed interconnect, said first and second drain regions isolated from each other, wherein a said selectable interconnect geometry can electrically connect the first and second drain regions; wherein, selecting a subset of the selectable interconnect geometries program the buffer input and output connections, and the buffer signal drive strength.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MADURAWE RAMINDA UDAYANot Provided

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Madurawe, Raminda Udaya Sunnyvale, US 83 5960

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation