Method of fabricating non-planar circuit board
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United States of America Patent
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Apr 24, 2012
Grant Date -
Oct 9, 2008
app pub date -
Apr 3, 2007
filing date -
Apr 3, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.
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