Method and apparatus for semiconductor wafer alignment
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United States of America Patent
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Apr 24, 2012
Grant Date -
Feb 28, 2008
app pub date -
Aug 23, 2006
filing date -
Aug 23, 2006
priority date (Note) -
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Abstract
The invention provides, in some aspects, a wafer alignment system comprising an image acquisition device, an illumination source, a rotatable wafer platform, and an image processor that includes functionality for mapping coordinates in an image of an article (such as a wafer) on the platform to a “world” frame of reference at each of a plurality of angles of rotation of the platform.
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