Abrasive, method of polishing target member and process for producing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8162725
APP PUB NO 20070266642A1
SERIAL NO

11878504

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI CHEMICAL COMPANY, LTD.TOKYO768

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ashizawa, Toranosuke Ibaraki-ken, JP 38 240
Kurata, Yasushi Ibaraki-ken, JP 61 512
Matsuzawa, Jun Ibaraki-ken, JP 23 228
Ootuki, Yuuto Ibaraki-ken, JP 12 117
Tanno, Kiyohito Ibaraki-ken, JP 13 151
Terazaki, Hiroki Ibaraki-ken, JP 24 210
Yoshida, Masato Ibaraki-ken, JP 187 2006

Cited Art Landscape

Patent Info (Count) # Cites Year
 
RODEL, INC. (1)
4959113 Method and composition for polishing metal surfaces 115 1989
 
MINNESOTA MINING AND MANUFACTURING COMPANY (1)
5653775 Microwave sintering of sol-gel derived abrasive grain 48 1996
 
RODEL HOLDINGS, INC. (1)
4462188 Silica sol compositions for polishing silicon wafers 69 1982
 
Rhone-Poulenc Chimie (2)
5011671 Ceric oxide with new morphological characteristics and method for obtaining same 19 1988
5026421 Polishing compositions based on cerium and process for the preparation thereof 21 1989
 
HITACHI CHEMICAL COMPANY, LTD. (2)
6221118 Cerium oxide abrasive and method of polishing substrates 54 1999
6863700 Cerium oxide abrasive and method of polishing substrates 18 2001
 
SONY CORPORATION (1)
6039631 Polishing method, abrasive material, and polishing apparatus 12 1998
 
CABOT MICROELECTRONICS CORPORATION (3)
4954142 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 218 1989
5527423 Chemical mechanical polishing slurry for metal layers 355 1994
5858813 Chemical mechanical polishing slurry for metal layers and films 173 1996
 
NIPPON SHOKUBAI CO., LTD. (1)
5260249 Catalyst for purifying automotive exhaust gas 50 1992
 
NISSAN CHEMICAL INDUSTRIES, LTD. (1)
5543126 Process for preparing crystalline ceric oxide 32 1995
 
MITSUI MINING & SMELTING CO., LTD. (1)
5766279 Polishing agent, method for producing the same and method for polishing 20 1996
 
MADELEINE L.L.C. (1)
4475981 Metal polishing composition and process 48 1983
 
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (3)
4588421 Aqueous silica compositions for polishing silicon wafers 65 1985
5264010 Compositions and methods for polishing and planarizing surfaces 113 1992
5389352 Oxide particles and method for producing them 58 1993
 
SUMITOMO CHEMICAL COMPANY, LIMITED (2)
5697992 Abrasive particle, method for producing the same, and method of use of the same 39 1996
5804513 Abrasive composition and use of the same 76 1997
 
FUJIMI INCORPORATED (1)
5997620 Polishing composition 42 1998
 
RHODIA CHIMIE (1)
5994260 Cerium oxide with pores having a lamellar structure, preparation method therefor and use thereof in catalysis 24 1999
 
RENESAS ELECTRONICS CORPORATION (1)
5772780 Polishing agent and polishing method 31 1995
 
SEIMI CHEMICAL CO. (1)
6120571 Polishing agent for semiconductor and method for its production 34 1998
 
KABUSHIKI KAISHA TOSHIBA (1)
5775980 Polishing method and polishing apparatus 55 1996
 
NIPPON AEROSIL CO., LTD. (1)
7192461 High concentration silica slurry 9 2003
 
VERSUM MATERIALS US, LLC (2)
5876490 Polish process and slurry for planarization 111 1997
5891205 Chemical mechanical polishing composition 40 1997
 
TIOXIDE SPECIALTIES LIMITED (1)
5525559 Preparation of mixed powders 9 1995
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
HITACHI CHEMICAL COMPANY, LTD. (1)
9022834 Polishing solution for CMP and polishing method using the polishing solution 0 2011
* Cited By Examiner

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