US Patent No: 8,162,725

Number of patents in Portfolio can not be more than 2000

Abrasive, method of polishing target member and process for producing semiconductor device

Stats

ALSO PUBLISHED AS: 20070266642
See full text
ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

Loading the Abstract Image... loading....

First Claim

See full text

all claims..

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI CHEMICAL COMPANY, LTD.TOKYO1156

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ashizawa, Toranosuke Hitachinaka, JP 48 158
Kurata, Yasushi Ibaraki, JP 74 335
Matsuzawa, Jun Ibaraki-ken, JP 34 174
Ootuki, Yuuto Ibaraki-ken, JP 20 87
Tanno, Kiyohito Ibaraki-ken, JP 22 111
Terazaki, Hiroki Tsukuba, JP 37 153
Yoshida, Masato Himeji, JP 204 1458

Cited Art Landscape

Patent Info (Count) # Cites Year
 
CABOT MICROELECTRONICS CORPORATION (3)
4,954,142 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 210 1989
5,527,423 Chemical mechanical polishing slurry for metal layers 301 1994
5,858,813 Chemical mechanical polishing slurry for metal layers and films 169 1996
 
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (3)
4,588,421 Aqueous silica compositions for polishing silicon wafers 63 1985
5,264,010 Compositions and methods for polishing and planarizing surfaces 112 1992
5,389,352 Oxide particles and method for producing them 53 1993
 
HITACHI CHEMICAL COMPANY, LTD. (2)
6,221,118 Cerium oxide abrasive and method of polishing substrates 48 1999
6,863,700 Cerium oxide abrasive and method of polishing substrates 13 2001
 
Rhone-Poulenc Chimie (2)
5,011,671 Ceric oxide with new morphological characteristics and method for obtaining same 16 1988
5,026,421 Polishing compositions based on cerium and process for the preparation thereof 21 1989
 
SUMITOMO CHEMICAL COMPANY, LIMITED (2)
5,697,992 Abrasive particle, method for producing the same, and method of use of the same 38 1996
5,804,513 Abrasive composition and use of the same 75 1997
 
AIR PRODUCTS AND CHEMICALS, INC. (1)
5,876,490 Polish process and slurry for planarization 105 1997
 
DUPONT AIR PRODUCTS NANOMATERIALS LLC (1)
5,891,205 Chemical mechanical polishing composition 38 1997
 
FUJIMI INCORPORATED (1)
5,997,620 Polishing composition 42 1998
 
KABUSHIKI KAISHA TOSHIBA (1)
5,775,980 Polishing method and polishing apparatus 53 1996
 
MADELEINE L.L.C., (NEW YORK LIMITED LIABILITY COMPANY) (1)
4,475,981 Metal polishing composition and process 48 1983
 
Minnesota Mining and Manufacturing Company (1)
5,653,775 Microwave sintering of sol-gel derived abrasive grain 44 1996
 
MITSUI MINING & SMELTING CO., LTD. (1)
5,766,279 Polishing agent, method for producing the same and method for polishing 19 1996
 
NIPPON AEROSIL CO., LTD. (1)
7,192,461 High concentration silica slurry 9 2003
 
NIPPON SHOKUBAI CO., LTD. (1)
5,260,249 Catalyst for purifying automotive exhaust gas 48 1992
 
NISSAN CHEMICAL INDUSTRIES, LTD. (1)
5,543,126 Process for preparing crystalline ceric oxide 30 1995
 
RENESAS ELECTRONICS CORPORATION (1)
5,772,780 Polishing agent and polishing method 29 1995
 
RHODIA CHIMIE (1)
5,994,260 Cerium oxide with pores having a lamellar structure, preparation method therefor and use thereof in catalysis 23 1999
 
RODEL HOLDINGS, INC. (1)
4,462,188 Silica sol compositions for polishing silicon wafers 67 1982
 
RODEL, INC. (1)
4,959,113 Method and composition for polishing metal surfaces 111 1989
 
SEIMI CHEMICAL CO. (1)
6,120,571 Polishing agent for semiconductor and method for its production 34 1998
 
SONY CORPORATION (1)
6,039,631 Polishing method, abrasive material, and polishing apparatus 11 1998
 
TIOXIDE SPECIALTIES LIMITED (1)
5,525,559 Preparation of mixed powders 9 1995

Patent Citation Ranking

Forward Cite Landscape

  • No Forward Cites to Display

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Oct 24, 2015
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 24, 2019
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 24, 2023
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00