Fluoride-modified silica sols for chemical mechanical planarization
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United States of America Patent
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Apr 24, 2012
Grant Date -
Nov 1, 2007
app pub date -
Apr 6, 2007
filing date -
Apr 18, 2006
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Expired
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Abstract
A chemical-mechanical planarization composition containing surface-modified abrasive particles such as silica where at least a portion of the surface of the particles has bound thereto a surface-modifying aluminum-containing stabilizer and fluoride that is used to polish semiconductor substrates. The use of a CMP slurry containing surface-modifying aluminum-containing stabilizer and fluoride bound to a silica abrasive provides high metal polishing rates relative to the removal rate of a dielectric.
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