US Patent No: 8,164,005

Number of patents in Portfolio can not be more than 2000

Multilayer high-frequency circuit board

ALSO PUBLISHED AS: 20080251288

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Importance

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Abstract

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A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KABUSHIKI KAISHA TOSHIBATOKYO39845

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kumamoto, Tsuyoshi Yokohama, JP 8 3
Nakada, Taihei Yokosuka, JP 15 7
Suzuki, Ryota Sagamihara, JP 41 28
Tanabe, Masahiro Shiga, JP 28 81
Yamashita, Yuusuke Yokohama, JP 4 2

Cited Art Landscape

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