Flip chip device and manufacturing method thereof
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United States of America Patent
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Apr 24, 2012
Grant Date -
Aug 20, 2009
app pub date -
Apr 24, 2009
filing date -
Dec 14, 2004
priority date (Note) -
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Abstract
A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.
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