US Patent No: 8,164,858
Number of patents in Portfolio can not be more than 2000
Read head having conductive filler in insulated hole through substrate
Stats
-
Apr 24, 2012
Issued date -
Nov 4, 2009
filing date -
12/612,575
serial no -
In Force
status
Importance
Loading Importance Indicators...
Abstract
A novel read head includes a substrate having a trailing face and a leading face opposite the trailing face. The substrate includes a first hole therethrough that extends continuously from the trailing face to the leading face. The read head also includes a read transducer disposed on the trailing face, and a first plurality of electrically conductive trailing connection pads disposed on the trailing face. A first insulative layer is disposed on an inner surface of the first hole. A first electrically conductive filler is disposed in the first hole but is insulated from the substrate by the first insulative layer. A first electrically conductive leading connection pad is disposed on the leading face and is electrically connected to the first conductive filler.
Loading the Abstract Image...
First Claim
Related Publications
Loading Related Publications...
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
|
|
|||
| 5,068,759 Thin film magnetic head of small size capable of certainly and stably connecting lead wires | 23 | 1990 | |
| 5,124,864 Magnetic head supporting device including a flexible member of polymeric resinous material | 39 | 1990 | |
| 5,126,901 Thin film magnetic head having a narrow upper surface | 15 | 1990 | |
| 5,200,869 Flying type thin film magnetic head having a transducing element | 15 | 1991 | |
| 5,384,432 Two-layered tape lead wire for magnetic head | 21 | 1993 | |
|
|
|||
| 6,349,017 Magnetic head suspension assembly using bonding pads of a slider to an attachment surface of a flexure | 28 | 1997 | |
| 5,896,248 Bond pads for metal welding of flexure to air bearing slider and grounding configuration thereof | 37 | 1997 | |
| 6,125,014 Via-less connection using interconnect traces between bond pads and a transducer coil of a magnetic head slider | 10 | 1998 | |
| 6,796,018 Method of forming a slider/suspension assembly | 10 | 2001 | |
| 6,947,258 UV curable and electrically conductive adhesive for bonding magnetic disk drive components | 10 | 2002 | |
|
|
|||
| 5,530,604 Electrical connection and slider-suspension assembly having an improved electrical connection | 51 | 1994 | |
| 7,535,676 Slider with bonding pads opposite the air bearing surface | 4 | 2004 | |
| 2006/0181,808 Compact thin-film magnetic head and magnetic disk drive using the same | 2 | 2006 | |
| 2007/0047,144 Magnetic head slider and suspension for magnetic head | 3 | 2006 | |
|
|
|||
| 6,757,135 Leading edge bond pads | 8 | 2001 | |
| 7,254,885 Wafer-level fabrication method for top or side slider bond pads | 2 | 2002 | |
| 7,929,248 Top bond pad for transducing head interconnect | 4 | 2006 | |
|
|
|||
| 4,761,699 Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file | 162 | 1986 | |
| 4,789,914 Thin film magnetic read-write head/arm assemblies | 88 | 1986 | |
|
|
|||
| 7,006,330 Head stack assembly including a ground conductive pad for grounding a slider to a gimbal | 13 | 2003 | |
| 7,027,264 Slider with a slider ground pad electrically connected to write head poles and read head shields | 8 | 2003 | |
|
|
|||
| 5,914,834 Head suspension assembly with electrical interconnect by slider bond pads and gimbal bonding zones | 19 | 1997 | |
|
|
|||
| 7,307,816 Flexure design and assembly process for attachment of slider using solder and laser reflow | 5 | 2001 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Oct 24, 2015 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 24, 2019 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 24, 2023 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |