US Patent No: 8,164,858

Number of patents in Portfolio can not be more than 2000

Read head having conductive filler in insulated hole through substrate

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Importance

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Abstract

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A novel read head includes a substrate having a trailing face and a leading face opposite the trailing face. The substrate includes a first hole therethrough that extends continuously from the trailing face to the leading face. The read head also includes a read transducer disposed on the trailing face, and a first plurality of electrically conductive trailing connection pads disposed on the trailing face. A first insulative layer is disposed on an inner surface of the first hole. A first electrically conductive filler is disposed in the first hole but is insulated from the substrate by the first insulative layer. A first electrically conductive leading connection pad is disposed on the leading face and is electrically connected to the first conductive filler.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WESTERN DIGITAL (FREMONT), LLCFREMONT, CA381

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
I, Gusti Made Subrata - 2 2
Moravec, Mark D Gilroy, CA 11 36
Pumkrachang, Santi - 2 2

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TDK CORPORATION (5)
5,068,759 Thin film magnetic head of small size capable of certainly and stably connecting lead wires 24 1990
5,124,864 Magnetic head supporting device including a flexible member of polymeric resinous material 40 1990
5,126,901 Thin film magnetic head having a narrow upper surface 16 1990
5,200,869 Flying type thin film magnetic head having a transducing element 16 1991
5,384,432 Two-layered tape lead wire for magnetic head 22 1993
 
WESTERN DIGITAL (FREMONT), INC. (5)
6,349,017 Magnetic head suspension assembly using bonding pads of a slider to an attachment surface of a flexure 29 1997
5,896,248 Bond pads for metal welding of flexure to air bearing slider and grounding configuration thereof 40 1997
6,125,014 Via-less connection using interconnect traces between bond pads and a transducer coil of a magnetic head slider 11 1998
6,796,018 Method of forming a slider/suspension assembly 11 2001
6,947,258 UV curable and electrically conductive adhesive for bonding magnetic disk drive components 12 2002
 
HGST NETHERLANDS B.V. (4)
5,530,604 Electrical connection and slider-suspension assembly having an improved electrical connection 53 1994
7,535,676 Slider with bonding pads opposite the air bearing surface 5 2004
2006/0181,808 Compact thin-film magnetic head and magnetic disk drive using the same 3 2006
2007/0047,144 Magnetic head slider and suspension for magnetic head 4 2006
 
SEAGATE TECHNOLOGY LLC (3)
6,757,135 Leading edge bond pads 9 2001
7,254,885 Wafer-level fabrication method for top or side slider bond pads 3 2002
7,929,248 Top bond pad for transducing head interconnect 7 2006
 
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. (2)
4,761,699 Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file 164 1986
4,789,914 Thin film magnetic read-write head/arm assemblies 89 1986
 
WESTERN DIGITAL TECHNOLOGIES, INC. (2)
7,006,330 Head stack assembly including a ground conductive pad for grounding a slider to a gimbal 18 2003
7,027,264 Slider with a slider ground pad electrically connected to write head poles and read head shields 9 2003
 
HUTCHINSON TECHNOLOGY INCORPORATED (1)
5,914,834 Head suspension assembly with electrical interconnect by slider bond pads and gimbal bonding zones 21 1997
 
WESTERN DIGITAL (FREMONT), LLC (1)
7,307,816 Flexure design and assembly process for attachment of slider using solder and laser reflow 7 2001

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
WESTERN DIGITAL (FREMONT), LLC (1)
8,756,795 Method for manufacturing a read head having conductive filler in insulated hole through substrate 0 2012
 
WESTERN DIGITAL TECHNOLOGIES, INC. (1)
8,797,691 Disk drive head suspension with a single piezoelectric element adhered to rotary-actuated and non-actuated portions of a structural layer of a tongue of a laminated flexure 0 2013

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Oct 24, 2015
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 24, 2019
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 24, 2023
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00