Method of manufacturing a printed circuit board
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United States of America Patent
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May 1, 2012
Grant Date -
Dec 3, 2009
app pub date -
May 30, 2008
filing date -
May 30, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a solder mask. The thermal transfer vias are filled to about 70% of capacity while the electrical vias are completely filled. Once filled, surfaces of the PCB are coated with an organic solderability preservative.
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