Bonding silicon silicon carbide to glass ceramics
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United States of America Patent
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May 1, 2012
Grant Date -
May 27, 2010
app pub date -
Feb 4, 2010
filing date -
Jan 24, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.
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