Power supply and heat dissipation module thereof
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United States of America Patent
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-
May 1, 2012
Grant Date -
Oct 6, 2011
app pub date -
Apr 6, 2010
filing date -
Apr 6, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.
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