Direct write and additive manufacturing processes
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United States of America Patent
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May 15, 2012
Grant Date -
Jul 8, 2010
app pub date -
May 30, 2008
filing date -
Jun 1, 2007
priority date (Note) -
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Abstract
A Direct Write method of forming components on a substrate by deposition of ink by thermally curing the ink in situ, which method overcomes the need for curing by placing the substrate in an oven. The curing is performed in an exemplary embodiment using an induction coil (6) through which an oscillating current is passed. The coil (6) is placed above the region in which Direct Write ink has been deposited. The oscillating current induces eddy currents in the ink to cause heating of the ink and thus fix the ink by curing, sintering etc.
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