Wafer level package with die receiving through-hole and method of the same
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United States of America Patent
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May 15, 2012
Grant Date -
Jul 3, 2008
app pub date -
Jan 3, 2007
filing date -
Jan 3, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die disposed within the die receiving through hole; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
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