Electronic component
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United States of America Patent
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-
May 15, 2012
Grant Date -
May 7, 2009
app pub date -
Sep 10, 2008
filing date -
Nov 2, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component includes: an active surface; a plurality of external connection terminals included in the active surface; a bump electrode disposed to the active surface, the bump electrode including: an internal resin formed on the active surface as a core; and a conductive film on a surface of the internal resin, the internal resin being formed in a nearly half-cylindrical shape having a transverse section of one of a nearly semicircular shape, a nearly semielliptical shape, and a nearly trapezoidal shape and extending orthogonal to the transverse section, the transverse section being orthogonal to the active surface; and a global wiring line disposed on the active surface and connecting between the plurality of external connection terminals, and at least one of the external connection terminals being electrically connected to the conductive film.
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