Printed circuit board, method of fabricating printed circuit board, and semiconductor device
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United States of America Patent
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May 15, 2012
Grant Date -
Nov 26, 2009
app pub date -
May 20, 2009
filing date -
May 23, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns.
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