Apparatus for temporary wafer bonding and debonding
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United States of America Patent
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May 22, 2012
Grant Date -
Jan 20, 2011
app pub date -
Apr 15, 2010
filing date -
Apr 16, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
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