Chemical mechanical polishing pad and dresser

United States of America Patent

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May 22, 2012
Grant Date
Sep 24, 2009
app pub date
Mar 24, 2008
filing date
Mar 24, 2008

priority date (Note)
Expired

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Abstract

The present invention discloses a Chemical Mechanical Polishing (CMP) pad dresser used in lapping and polishing silicon wafers in either single or double sided polishing machines.

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Patent Owner(s)

Patent Owner	Address
NGUYEN PHUONG VAN	Not Provided

International Classification(s)

B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Nguyen, Phuong Van	San Jose, US	11	182

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Chemical mechanical polishing pad and dresser

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United States of America Patent

12054018

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PATENT NO	8182315
APP PUB NO	20090239456A1
SERIAL NO	12054018
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 22, 2012	US,8182315,B2 US8182315B2	GRANTED PATENT AS SECOND PUBLICATION
September 24, 2009	US,20090239456,A1 US20090239456A1	FIRST PUBLISHED PATENT APPLICATION

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12054018

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