Method for texturing silicon wafers for producing solar cells
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United States of America Patent
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May 22, 2012
Grant Date -
Oct 1, 2009
app pub date -
Jul 12, 2007
filing date -
Aug 19, 2006
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Abstract
In a method for texturing silicon wafers for producing solar cells, the step of introducing a silicon wafer involves the use of a texturing solution which is at a temperature of at least 80 degrees Celsius and which comprises water admixed with 1 percent by weight to 6 percent by weight KOH or 2 percent by weight to 8 percent by weight NaOH and with a surfactant or a surfactant mixture constituting less than 0.01 percent by weight. Very economic texturing can be performed in this way.
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