Laser piercing method and processing apparatus
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United States of America Patent
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May 22, 2012
Issued Date -
N/A
app pub date -
Jun 6, 2006
filing date -
Jun 7, 2005
priority date (Note) -
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Abstract
A processing apparatus is provided in which a laser beam L2 is irradiated onto a processing portion of a workpiece W, and at the same time as the laser irradiation, an assist gas G is injected toward the processing portion from a nozzle 3 arranged concentric to the laser beam L2 so that the processing portion is covered with the assist gas G, thereby processing a piercing hole H on the processing portion. The apparatus includes control means 10 for processing a piercing hole H while moving the nozzle 3 within the range of 5 mm from a processing start point after the irradiation of the laser beam L2 is started.
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